Microsystems and nanosystems: Definitions and examples. Relationship between microelectronic, micro-optical and micro-electro-mechanical technology. Basic microelectronic technology processes and modeling: Thermal oxidation, dopant diffusion, ion implantation, physical and chemical deposition, e-beam and optical lithography, plasma etching. Advanced processes for nanoelectronics. Special processes for micromechanics and microsensor fabrication. Surface, bulk micromachining. Physical principles of sensors operation. Examples on fabrication and operation of physical and biochemical microsensors. Lab-on-Chip and biosensors. From microtechnology to nanotechnology: Methods of fabrication at the nanoscale. Top-down and bottom-up approaches. Fabrication of nanoparticles and nanowires, their interaction with the macro-world and application to sensing. Nanometrology.
ECTS : 4
Study Load : theory 3, lab 1
Language : el, en
Learning Outcomes : Understand the technology used in the fabrication of integrated circuits. • Calculate the dopant distribution in silicon after implantation and thermal processes. • Determine the most suitable conditions for thermal oxide formation, depending on its intended use in the fabrication of a microelectronic device. • Select the most appropriate deposition process for insulating and conductive layers according to their intended role in an integrated circuit. • Understand the processes that enable material patterning through lithography and etching. • Design a sensor based on the physical quantity to be measured, combining the operating physical principle with its fabrication technology. • Understand micromachining techniques that allow the fabrication of freely moving microstructures (cantilevers, bridges, resonators). • Recognize how nanotechnology can be combined with micromachining and microtechnology to enhance the sensitivity of chemical and biochemical sensors.